Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17395874
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Filing Dt:
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08/06/2021
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Publication #:
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Pub Dt:
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11/25/2021
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Inventors:
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Hiroyuki AMANO, Yuki ANTOKU, Takeshi KUWAHARA, Tsukasa ICHIKAWA
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Title:
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PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2303-15, YOSHIDA, YOSHINOGARI-CHO |
KANZAKI-GUN, SAGA, JAPAN 842-0031 |
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ORRICK, HERRINGTON & SUTCLIFFE LLP |
2050 MAIN STREET, SUITE 1100 |
IRVINE, CA 92614 |
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05/15/2024 06:45 AM
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