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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/23/2024
Application #:
17282001
Filing Dt:
04/01/2021
Publication #:
Pub Dt:
05/26/2022
Inventors:
Weiyun WANG, Xinqiang WANG, Yongde LI, Houjin WANG, Junjie KANG, Ye YUAN, Wei LUO
Title:
ELECTRONIC DEVICE, SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE, BRACKET AND METHOD OF MANUFACTURING THE BRACKET
Assignment: 1
Reel/Frame:
055791/0568Recorded: 04/01/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Assignee:
BUILDING A1, INNOVATION CITY
SONGSHAN LAKE UNIVERSITY
DONGGUAN CITY, GUANGDONG, CHINA 523000
Correspondent:
THOMPSON HINE LLP
10050 INNOVATION DRIVE
SUITE 400
DAYTON, OH 45342-4934

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