Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17440023
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Filing Dt:
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09/16/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Inventors:
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Hiroyuki MORITA, Takeshi WAKIYA
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Title:
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RESIN PARTICLES, CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI |
OSAKA, JAPAN 530-8565 |
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WENDEROTH, LIND & PONACK, L.L.P. |
1025 CONNECTICUT AVENUE, N.W. |
SUITE 500 |
WASHINGTON, DC 20036 |
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05/05/2024 09:09 PM
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