Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17239650
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Filing Dt:
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04/25/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Inventor:
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DONG KWAN KIM
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| VOLENTINE, WHITT & FRANCOS, PLLC |
| 300 E MAIN ST., SUITE 302 |
| CHARLOTTESVILLE, VA 22902 |
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05/21/2024 01:44 PM
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