Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17270381
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Filing Dt:
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02/22/2021
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Publication #:
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Pub Dt:
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06/17/2021
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Inventor:
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Tsuyoshi MIHARA
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Title:
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BONDING INTERFACE EVALUATION METHOD AND BONDING INTERFACE EVALUATION DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1-1, KATAHIRA, AOBA-KU |
| SENDAI-SHI, MIYAGI, JAPAN 980-8577 |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1060, NISHIKAWATSUCHO, MATSUE-SHI |
| SHIMANE, JAPAN 6908504 |
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| JESSE O. COLLIER |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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05/01/2024 02:38 AM
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