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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/13/2024
Application #:
17535933
Filing Dt:
11/26/2021
Publication #:
Pub Dt:
11/24/2022
Inventors:
EUN HYEA KO, HEE YEON JEONG, JUN HEE CHO, GYU-HEE PARK, JOONG JIN PARK, BYEONG IL YANG et al
Title:
ATOMIC LAYER ETCHING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
Assignment: 1
Reel/Frame:
058217/0048Recorded: 11/27/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/02/2021
Exec Dt:
11/02/2021
Exec Dt:
11/03/2021
Exec Dt:
11/02/2021
Exec Dt:
11/03/2021
Exec Dt:
11/02/2021
Exec Dt:
11/02/2021
Exec Dt:
11/02/2021
Assignees:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
142, DAEHWA-RO 132BEONG-GIL
DAEDEOK-GU, DAEJEON, KOREA, REPUBLIC OF 34366
Correspondent:
VOLENTINE, WHITT & FRANCOS, PLLC
300 E MAIN ST., SUITE 302
CHARLOTTESVILLE, VA 22902

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