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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/13/2024
Application #:
17712306
Filing Dt:
04/04/2022
Publication #:
Pub Dt:
07/14/2022
Inventors:
Cheng-Yi Wu, Ching-Wen Wen, Li-Hsuan Chu, Chia-Chun Hung, Chin-Szu Lee, Chen Liang Chang et al
Title:
Dielectric Film for Semiconductor Fabrication
Assignment: 1
Reel/Frame:
059509/0153Recorded: 04/05/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
09/30/2016
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
10/12/2016
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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