Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17706848
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Filing Dt:
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03/29/2022
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Publication #:
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Pub Dt:
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07/14/2022
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Inventors:
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Ronald Patrick Huemoeller, Michael Kelly, David Jon Hiner
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Title:
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SEMICONDUCTOR PACKAGE WITH ROUTING PATCH AND CONDUCTIVE INTERCONNECTION STRUCTURES LATERALLY DISPLACED FROM ROUTING PATCH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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06/03/2024 04:39 PM
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