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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11903195
Issue Dt:
02/13/2024
Application #:
18156619
Filing Dt:
01/19/2023
Publication #:
20230157020
Pub Dt:
05/18/2023
Inventors:
Haihui HUANG, Yaohua YANG, Jia HE, Fandong LIU, Peizhen HONG, Zongliang HUO, Baoyou CHEN et al
Title:
Openings Layout of Three-Dimensional Memory Device
Assignment: 1
Reel/Frame:
062447/0194Recorded: 01/23/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HE, JIA
Exec Dt:
08/21/2018
HUANG, HAIHUI
Exec Dt:
08/21/2018
LIU, FANDONG
Exec Dt:
08/21/2018
YANG, YAOHUA
Exec Dt:
08/21/2018
HONG, PEIZHEN
Exec Dt:
08/21/2018
XIA, ZHILIANG
Exec Dt:
08/21/2018
HUO, ZONGLIANG
Exec Dt:
08/21/2018
FENG, YAOBIN
Exec Dt:
08/21/2018
CHEN, BAOYOU
Exec Dt:
08/21/2018
CAO, QINGCHEN
Exec Dt:
08/21/2018
Assignee:
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
NO. 88 WEILAI 3RD ROAD
EAST LAKE HIGH-TECH DEVELOPMENT ZONE
WUHAN, HUBEI, CHINA 430000
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C.
1100 NEW YORK AVENUE, NW
WASHINGTON, DC 20005

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