Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2024
|
Application #:
|
17826975
|
Filing Dt:
|
05/27/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2022
| | | | |
|
Inventor:
|
Mamoru YAMAGAMI
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 21, SAIIN MIZOSAKI-CHO, UKYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 615-8585 |
|
|
|
|
| BRIAN D. WALKER |
| P.O. DRAWER 800889 |
| DALLAS, TX 75380 |
|
|
Search Results as of:
05/12/2024 07:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
