Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17497368
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Filing Dt:
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10/08/2021
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Publication #:
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Pub Dt:
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12/08/2022
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Inventor:
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Jeong Hyun PARK
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Title:
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SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DIE STACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17336 |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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06/02/2024 06:54 AM
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