Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17191841
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Filing Dt:
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03/04/2021
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Publication #:
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Pub Dt:
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09/16/2021
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Inventors:
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Yosuke HANAWA, Dai UEDA
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Title:
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Substrate Processing Liquid for Etching a Metal Layer, Substrate Processing Method and Substrate Processing Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME |
| HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 602-8585 |
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| OSTROLENK FABER LLP |
| 845 THIRD AVENUE |
| 8TH FLOOR |
| NEW YORK, NY 10022 |
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04/30/2024 12:52 AM
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