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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/20/2024
Application #:
17819920
Filing Dt:
08/15/2022
Publication #:
Pub Dt:
10/12/2023
Inventors:
Hong Tu ZHANG, Pui Yin YU
Title:
CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
Assignment: 1
Reel/Frame:
061105/0133Recorded: 09/15/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/06/2022
Exec Dt:
07/06/2022
Assignee:
11 BISHAN STREET 21, #03-01
SINGAPORE, SINGAPORE 573943
Correspondent:
AARON W. PEDERSON
CARLSON, CASPERS, VANDENBURGH & LINDQUIST P.A.
225 S. SIXTH ST., SUITE 4200
MINNEAPOLIS, MN 55402

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