Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17962061
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Filing Dt:
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10/07/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Takayuki SAITOH, Takayuki MORIWAKI, Takehito SHIMATSU, Miyuki UOMOTO
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Title:
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CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYBRID BONDING METHOD FOR ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-5-1, KURIGI, ASAO-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 2158550 |
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| 2-1-1, KATAHIRA, AOBA-KU |
| SENDAI-SHI, MIYAGI, JAPAN 9808577 |
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| BUCHANAN INGERSOLL & ROONEY PC |
| 1737 KING STREET, SUITE 500 |
| ALEXANDRIA, VA 22314 |
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04/29/2024 12:49 PM
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