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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/27/2024
Application #:
17418816
Filing Dt:
06/26/2021
Publication #:
Pub Dt:
03/03/2022
Inventor:
Xinyu LI
Title:
BONDING CAVITY STRUCTURE AND BONDING METHOD
Assignment: 1
Reel/Frame:
056679/0614Recorded: 06/26/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/26/2021
Assignees:
497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG
SHANGHAI, CHINA 201210
NO. 497, LOULU ROAD, JIADING INDUSTRIAL ZONE
SHANGHAI, CHINA
Correspondent:
TIANCHEN LLC.
3302 TOWER1, NO.388 ZHONGJIANG ROAD, PUTUO
SHANGHAI, 200062 CHINA

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