Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17584003
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Filing Dt:
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01/25/2022
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Publication #:
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Pub Dt:
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05/12/2022
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Inventors:
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Xianglan Wu, Zhigang Yang, Siping Bai, Zhijian Wang, Jinqiang Zhang
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Title:
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SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM#8078, 8F, HI-TECH BUILDING, NO. 2 |
| JIAYUAN ROAD, EAST LAKE HI-TECH DEVELOPMENT ZONE |
| WUHAN, CHINA 430074 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| SUITE 2800 |
| 1100 PEACHTREE STREET NE |
| ATLANTA, GA 30309 |
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04/29/2024 05:54 AM
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