Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17877824
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Filing Dt:
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07/29/2022
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Inventors:
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Cheng-Ta WU, Chii-Ming WU, Sen-Hong SYUE, Cheng-Po CHAU
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Title:
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METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING ISOLATION STRUCTURES WITH DIFFERENT THICKNESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 111 S MAIN ST #600 |
| SALT LAKE CITY, UT 84111 |
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05/13/2024 05:37 AM
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