Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17977764
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Filing Dt:
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10/31/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Takuo KISAKI, Takahiro SASAKI
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Title:
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WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE EACH HAVING PLATE-SHAPED CONDUCTIVE PORTION IN FRAME PORTION OF INSULATION SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, TAKEDA TOBADONO-CHO |
| FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
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