Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17476995
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Filing Dt:
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09/16/2021
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Publication #:
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Pub Dt:
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07/14/2022
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Inventors:
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Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
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Title:
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MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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MORGAN LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVENUE NW |
WASHINGTON, DC 20004 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE FIRST INVENTOR PREVIOUSLY RECORDED AT REEL: 057528 FRAME: 0624. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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MORGAN LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVENUE NW |
WASHINGTON, DC 20004 |
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05/27/2024 05:11 AM
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