Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17532248
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Filing Dt:
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11/22/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Inventors:
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Mingyu WANG, Kerui XI, Xuhui PENG, Feng QIN, Jie ZHANG
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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888, 889 HUIQING RD. |
PUDONG NEW DISTRICT |
SHANGHAI, CHINA |
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CHRISTENSEN O'CONNOR JOHNSON KINDNESS PLLC |
1201 THIRD AVENUE |
SUITE 3600 |
SEATTLE, WA 98101 |
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05/13/2024 02:31 AM
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