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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/12/2024
Application #:
17228490
Filing Dt:
04/12/2021
Publication #:
Pub Dt:
10/13/2022
Inventors:
LING ZHOU, Alex Lunev, Jianping Zhang, Huazhong Deng, Ying Gao
Title:
LIGHT-EMITTING DIODE PACKAGE USING FLUID ENCAPSULATE
Assignment: 1
Reel/Frame:
055896/0214Recorded: 04/12/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/09/2021
Exec Dt:
04/09/2021
Exec Dt:
04/09/2021
Exec Dt:
04/09/2021
Exec Dt:
04/09/2021
Assignee:
1172 MURPHY AVE., SUITE 237
SAN JOSE, CALIFORNIA 95131
Correspondent:
J.C. PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618

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