Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2024
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Application #:
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17718182
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Filing Dt:
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04/11/2022
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Publication #:
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Pub Dt:
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07/28/2022
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Inventors:
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Cheng-Yi PENG, Chun-Chieh LU, Meng-Hsuan HSIAO, Ling-Yen YEH, Carlos H. DIAZ et al
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Title:
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METHOD FOR FORMING INTEGRATED SEMICONDUCTOR DEVICE WITH 2D MATERIAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MASCHOFF BRENNAN |
| 1389 CENTER DRIVE, SUITE 300 |
| PARK CITY, UT 84098 |
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