Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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17465232
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Filing Dt:
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09/02/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Min-Feng KAO, Hsing-Chih LIN, Jen-Cheng LIU, Dun-Nian YAUNG
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Title:
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THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAYNES AND BOONE, LLP IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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05/15/2024 08:54 AM
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