Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17317977
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Filing Dt:
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05/12/2021
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Inventors:
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Kuo-Ming Wu, Hau-Yi Hsiao, Yung-Lung Lin, Sheng-Chau Chen, Cheng-Yuan Tsai
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Title:
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DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK, LLC |
| ROSETTA CENTER |
| 629 EUCLID AVE., SUITE 1000 |
| CLEVELAND, OH 44114 |
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05/14/2024 10:52 AM
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