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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/09/2024
Application #:
17043736
Filing Dt:
09/30/2020
Publication #:
Pub Dt:
02/04/2021
Inventor:
Guohong YANG
Title:
RESIN SPACER FOR CHIP STACKING AND PACKAGING AND PREPARATION METHOD THEREOF
Assignment: 1
Reel/Frame:
053926/0590Recorded: 09/30/2020Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/11/2020
Assignee:
NO.15 ZHONGHONG ROAD, HUQIU DISTRICT, JIANGSU
SUZHOU, CHINA 215100
Correspondent:
GOKALP BAYRAMOGLU
1540 WEST WARM SPRINGS RD., SUITE 100
HENDERSON, NV 89014

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