Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17540322
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Filing Dt:
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12/02/2021
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Publication #:
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Pub Dt:
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06/08/2023
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Inventors:
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Yi LIN, Kar Weng YAN, Teng Hock KUAH, Ravindra RAGHAVENDRA, Angelito Barrozo PEREZ
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Title:
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ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 845 THIRD AVENUE |
| 8TH FLOOR |
| NEW YORK, 10022 UNITED STATES |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 845 THIRD AVENUE |
| 8TH FLOOR |
| NEW YORK, NY 10022 |
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