Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17021776
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Filing Dt:
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09/15/2020
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Publication #:
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Pub Dt:
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03/17/2022
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Inventors:
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Chun-I TSAI, Pei-Wen WU, Chi-Cheng HUNG, Yu-Sheng WANG, Jyh-Cherng SHEU, Ming-Hsing TSAI
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Title:
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METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HARRITY AND HARRITY, LLP |
| 11350 RANDOM HILLS ROAD |
| SUITE 600 |
| FAIRFAX, VA 22030 |
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