Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17413728
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Filing Dt:
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06/14/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Nao Honda, Hiroki Oshida, Tadashi Naito, Yoshihiro Hakone, Mamoru Sunada
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Title:
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Hollow Package And Method For Manufacturing Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 1400002 |
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| 1-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1000005 |
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| 5, KAMITOBA, KAMICHOSHI-CHO |
| MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 6018105 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE #5 |
| WESTBOROUGH, MA 01581 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1000005 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET - SUITE 5 |
| WESTBORO, MA 01581 |
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