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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/09/2024
Application #:
17815761
Filing Dt:
07/28/2022
Publication #:
Pub Dt:
01/12/2023
Inventors:
Shih-Chuan Chiu, Chia-Hao Chang, Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su et al
Title:
Dual Side Contact Structures In Semiconductor Devices
Assignment: 1
Reel/Frame:
060661/0496Recorded: 07/28/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/08/2020
Exec Dt:
12/08/2020
Exec Dt:
12/08/2020
Exec Dt:
12/09/2020
Exec Dt:
12/08/2020
Exec Dt:
12/08/2020
Exec Dt:
12/08/2020
Exec Dt:
12/08/2020
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU CITY, TAIWAN 300-78
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C.
1100 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20005

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