Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17860291
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Filing Dt:
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07/08/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Shoji TAKEI, Yuji KOGA
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Title:
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SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE INCLUDING A COPPER PILLAR AND AN INTERMEDIATE LAYER AND A CONCAVE PORTION FORMED AT ONE END SURFACE OF THE COPPER PILLAR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 615-8585 |
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| RABIN & BERDO, P.C. |
| 2650 PARK TOWER DRIVE, SUITE 800 |
| VIENNA, VA 22180 |
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