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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/16/2024
Application #:
17906937
Filing Dt:
09/21/2022
Publication #:
Pub Dt:
11/23/2023
Inventors:
Pengfei QIU, Lidong CHEN, Xun SHI, Zhiqiang GAO, Shiqi YANG, Qingyu YANG
Title:
METHOD FOR PREPARING THERMOELECTRIC THICK FILM
Assignment: 1
Reel/Frame:
061171/0219Recorded: 09/21/2022Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/16/2022
Exec Dt:
09/14/2022
Exec Dt:
09/14/2022
Exec Dt:
09/15/2022
Exec Dt:
09/14/2022
Exec Dt:
09/14/2022
Assignee:
1295 DINGXI ROAD, CHANGNING DISTRICT
SHANGHAI, CHINA 200050
Correspondent:
ALLEMAN HALL CREASMAN & TUTTLE LLP
900 SW 5TH AVENUE
SUITE 2300
PORTLAND, OR 97204

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