Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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18122431
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Filing Dt:
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03/16/2023
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Publication #:
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Pub Dt:
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07/06/2023
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Inventors:
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David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Title:
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HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AMP TECHNOLOGY CENTRE |
| BRUNEL WAY, ROTHERHAM |
| SOUTH YORKSHIRE, UNITED KINGDOM S60 SWG |
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| BUTZEL LONG |
| 1909 K ST. NW |
| SUITE 860 |
| WASHINGTON, 20006 UNITED STATES |
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