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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2024
Application #:
17867774
Filing Dt:
07/19/2022
Publication #:
Pub Dt:
07/06/2023
Inventors:
Nianbin Cheng, Cheng Li, Lifang Liang, Yikai Yuan, Honggui Zhan, Xiangxuan Tan
Title:
POWER MODULE AND HEAT SINK SYSTEM
Assignment: 1
Reel/Frame:
060545/0324Recorded: 07/19/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/13/2022
Exec Dt:
07/13/2022
Exec Dt:
07/13/2022
Exec Dt:
07/13/2022
Exec Dt:
07/13/2022
Exec Dt:
07/13/2022
Assignee:
NO. 18 SOUTH HUABAO ROAD, CHANCHENG DISTRICT
FOSHAN, CHINA 528000
Correspondent:
BOND SCHOENECK & KING, PLLC
ONE LINCOLN CENTER
GEORGE R. MCGUIRE
SYRACUSE, NY 13202

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