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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/07/2024
Application #:
18092756
Filing Dt:
01/03/2023
Inventors:
Riju Biswas, Abhishek Shrivastava
Title:
HIGH-SPEED SERIAL LINK SIGNAL CHAIN
Assignment: 1
Reel/Frame:
062335/0106Recorded: 01/11/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2023
Exec Dt:
12/03/2022
Assignee:
2655 SEELY AVENUE
SAN JOSE, CALIFORNIA 95134
Correspondent:
SLW / CADENCE DESIGN SYSTEMS
P.O. BOX 2938
MINNEAPOLIS, MN 55402

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