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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11981834
Issue Dt:
05/14/2024
Application #:
18530577
Filing Dt:
12/06/2023
Inventors:
Li CHENG, Zhengbiao GU, Zhaofeng LI, Dongdong WU, Mengwei ZHANG, Yan HONG, Caiming LI et al
Title:
High-temperature Fast-curing Starch-based Adhesive for Particleboards and Preparation Method Thereof
Assignment: 1
Reel/Frame:
065778/0792Recorded: 12/06/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHENG, LI
Exec Dt:
11/21/2023
GU, ZHENGBIAO
Exec Dt:
11/24/2023
HONG, YAN
Exec Dt:
11/24/2023
LI, ZHAOFENG
Exec Dt:
11/25/2023
LI, CAIMING
Exec Dt:
11/25/2023
BAN, XIAOFENG
Exec Dt:
11/24/2023
JIN, JUNNAN
Exec Dt:
11/23/2023
WU, DONGDONG
Exec Dt:
11/23/2023
ZHANG, MENGWEI
Exec Dt:
11/23/2023
YIN, JIAN
Exec Dt:
11/23/2023
Assignee:
JIANGNAN UNIVERSITY
1800 LIHU AVENUE, BINHU DISTRICT
JIANGSU PROVINCE
WUXI, CHINA
Correspondent:
IPRO, PLLC
12332 TOWNCENTER PLAZA
PMB# 816
STERLING, VA 20164

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