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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/14/2024
Application #:
18066071
Filing Dt:
12/14/2022
Publication #:
Pub Dt:
04/20/2023
Inventors:
Li-Zhen Yu, Lin-Yu Huang, Chih-Hao Wang, Huan-Chieh Su, Cheng-Chi Chuang
Title:
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP
Assignment: 1
Reel/Frame:
062109/0474Recorded: 12/15/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/05/2021
Exec Dt:
02/05/2021
Exec Dt:
02/05/2021
Exec Dt:
02/05/2021
Exec Dt:
03/04/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DR STE. 300
PARK CITY, UT 84098

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