Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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18066071
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Filing Dt:
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12/14/2022
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Publication #:
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Pub Dt:
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04/20/2023
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Inventors:
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Li-Zhen Yu, Lin-Yu Huang, Chih-Hao Wang, Huan-Chieh Su, Cheng-Chi Chuang
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Title:
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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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R. BURNS ISRAELSEN |
MASCHOFF BRENNAN |
1389 CENTER DR STE. 300 |
PARK CITY, UT 84098 |
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10/31/2024 07:44 PM
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