Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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18110666
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Filing Dt:
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02/16/2023
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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FU-CHOU LIU, YU-CHIANG PENG, YA-HAN CHANG, JUI-HUNG HSU, CHIEN-CHEN LEE, LI-CHUN HUNG
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Title:
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SENSOR PACKAGE STRUCTURE HAVING RING-SHAPED SOLDER MASK FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6 F. , NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
| TAIPEI CITY, TAIWAN 10043 |
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| LI & CAI INTELLECTUAL PROPERTY (USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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