Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/16/1985
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Application #:
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06302351
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Filing Dt:
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09/15/1981
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Inventors:
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HARUO MORI, YASUO HOSODA, YUTAKA OHTA, HIROSHI TANABE, KOTARO KATO
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Title:
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HIGH VOLTAGE INTEGRATED SEMICONDUCTOR DEVICES USING A THERMOPLASTIC RESIN LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 7-1, TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| UCHISAWWAI-CHO, 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| WENDEROTH, LIND & PONACK |
| 1750 PA. AVENUE,N.W., STE. 1100 |
| WASHINGTON, DC 20006 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE ON 07/12/1985
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| JOHN C. SMITH, JR. |
| 2001 JEFF. DAVIS HWY., STE. 501 |
| ARLINGTON, VA. 22202 |
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