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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/06/1985
Application #:
06192961
Filing Dt:
10/02/1980
Inventor:
PHILIP C. SMITH
Title:
DEVICE STRUCTURES FOR HIGH DENSITY INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
003820/0192Recorded: 10/02/1980Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
10/02/1980
Assignee:
WESTINGHOUSE BLDG., GATEWAY CENTER
PITTSBURGH, PENNSYLVANIA 15222
Correspondent:
C. F. RENZ
WESTINGHOUSE ELECTRIC CORP.
R&D CENTER, PATENT DEPT.
PITTSBURGH, PA 15235
Assignment: 2
Reel/Frame:
007722/0071Recorded: 11/03/1995Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/10/1995
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83706
Correspondent:
SEED AND BERRY
DAVID V. CARLSON
6300 COLUMBIA CENTER, 701 FIFTH AVENUE
SEATTLE, WA 98104-7092

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