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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/13/1985
Application #:
06539413
Filing Dt:
10/06/1983
Inventors:
YOSHIKI MIMURA, TETSUJI ARAI, HIROSHI SHIMIZU, SATORU FUKUDA
Title:
HEATER ASSEMBLY AND A HEAT-TREATMENT METHOD OF SEMICONDUCTOR WAFER USING THE SAME
Assignment: 1
Reel/Frame:
004211/0509Recorded: 10/18/1983Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
09/09/1983
Exec Dt:
09/09/1983
Exec Dt:
09/09/1983
Exec Dt:
09/09/1983
Assignee:
TOKYO, JAPAN
Correspondent:
ZIEMS AND WALTER
6862 ELM STREET
P. O. BOX 1055
MCLEAN, VA 22101

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