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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/13/1985
Application #:
06626359
Filing Dt:
06/29/1984
Inventors:
CHARLES J. KRAUS, HERBERT I. STOLLER, LEON LI-HENG WU
Title:
HIGH DENSITY WIRED MODULE
Assignment: 1
Reel/Frame:
004299/0929Recorded: 09/13/1984Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
09/10/1984
Exec Dt:
09/10/1984
Exec Dt:
09/11/1984
Assignee:
ARMONK,, NEW YORK 10504
Correspondent:
ROBERT J. HAASE
IBM CORP., PATENT OPERS.
DEPT. 901, BLDG. 300-482
HOPEWELL JUNCTION, NY 12533

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