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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	4540603	Issue Dt:	09/10/1985	Application #:	06563039	Filing Dt:	12/19/1983
Inventors:	TOSHIYUKI HIDAKA, HISASHI SAKAMOTO, TOSHIAKI FUKUHARA, YUTAKA MISAWA, SADAO FUJIEDA
Title:	RESIN-MOLDED SEMICONDUCTOR DEVICE AND A PROCESS FOR MANUFACTURING THE SAME

Assignment: 1

Reel/Frame:

Recorded: 12/18/1984

Pages: 1

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST.

Assignors:

HIDAKA, TOSHIYUKI

Exec Dt:

11/30/1983

SAKAMOTO, HISASHI

Exec Dt:

11/30/1983

FUKUHARA, TOSHIAKI

Exec Dt:

11/30/1983

Exec Dt:

11/30/1983

Exec Dt:

11/30/1983

Assignee:

HITACHI, LTD., A CORP. OF JAPAN

6, KANDA SURUGADAI 4-CHOME

CHIYODA-KU, TOKYO, JAPAN

Correspondent:

ANTONELLI, TERRY AND WANDS

STE. 600, 1919 PA AVENUE, N.W.

WASHINGTON, DC 20006

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