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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/18/1986
Application #:
06615463
Filing Dt:
05/30/1984
Inventors:
YASUMASA NODA, YOICHI SUZUKI
Title:
APPARATUS FOR PREHEATING MOLD RESIN FOR A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
004267/0297Recorded: 05/30/1984Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
05/23/1984
Exec Dt:
05/23/1984
Assignee:
72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI
KANAGAWA-KEN, JAPAN
Correspondent:
SCHWARTZ, JEFFERY, SCHWAAB, MACK,
BLUMENTHAL & KOCH
111 NORTH ALFRED ST.
P. O. BOX 299
ALEXANDRIA, VA 22313

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