Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/16/1986
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Application #:
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06615499
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Filing Dt:
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05/30/1984
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Inventors:
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JAMES E. DRYE, JACK A. SCHROEDER, VERN H. WINCHELL II
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Title:
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HIGH DENSITY IC MODULE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORP. OF DE |
SCHAUMBURG, ILLINOIS |
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VINCENT J. RAUNER |
4250 E. CAMELBACK RD., STE. 300K |
PHOENIX, AZ 85018 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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FREESCALE SEMICONDUCTOR, INC. |
JENNIFER B. WUAMETT |
7700 W. PARMER LANE |
MD:TX32/PL02 |
AUSTIN, TX 78729 |
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