Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/1987
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Application #:
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06809895
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Filing Dt:
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12/17/1985
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Inventors:
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RENSEI FUTATSUKA, SEIJI KUMAGAI, MASUHIRO IZUMIDA
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Title:
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COPPER ALLOY LEAD MATERIAL FOR LEADS OF A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| FRISHAUF, HOLTZ, GOODMAN & WOODWARD |
| 261 MADISON AVE. |
| NEW YORK, NY 10016 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE AS OF AUG.1,1986
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| FRISHAUF, HOLTZ, GOODMAN & WOODWARD |
| 261 MADISON AVE. |
| NEW YORK, NY 10016 |
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