Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/28/1987
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Application #:
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06829095
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Filing Dt:
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02/12/1986
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Inventors:
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YOSHIFUMI MIYAKE, SUMIO SAKKA
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Title:
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RESIN MOLDING COMPOUND FOR SEALING ELECTRONIC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1-9, DOJIMA 2-CHOME, KITA-KU, |
| OSAKA, JAPAN |
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| WENDEROTH, LIND AND PONACK |
| 1750 PENNSYLVANIA AVE., N. W. |
| SUITE 1100, |
| WASHINGTON, DC 20006 |
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