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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/18/1987
Application #:
06838065
Filing Dt:
03/10/1986
Inventors:
CHARLES J. KRAUS, HERBERT I. STOLLER, LEON LI-HENG WU
Title:
MULTILAYERED INTERPOSER BOARD FOR POWERING HIGH CURRENT CHIP MODULES
Assignment: 1
Reel/Frame:
004529/0804Recorded: 03/10/1986Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
03/06/1986
Exec Dt:
03/06/1986
Exec Dt:
03/06/1986
Assignee:
ARMONK, NEW YORK 10504
Correspondent:
ROBERT J. HAASE
IBM CORP., DEPT., 901/BLDG. 300-482
HOPEWELL JUNCTION, NY 12533-9988

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