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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/25/1987
Application #:
06813801
Filing Dt:
12/27/1985
Inventor:
TAKATOSHI ONO
Title:
SEMICONDUCTOR WAFER DICING MACHINE
Assignment: 1
Reel/Frame:
004497/0476Recorded: 12/27/1985Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
12/12/1985
Assignee:
14-3 HIGASHI KOJIYA 2-CHOME, OTA-KU
A CORP. OF JAPAN
TOKYO, JAPAN
Correspondent:
BEVERIDGE, DE GRANDI & WEILACHER
SUITE 1100,
1819 H STREET, N. W.
WASHINGTON, DC 20006

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