Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/1987
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Application #:
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06755904
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Filing Dt:
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07/17/1985
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Inventors:
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CLAUDE DEHENNAU, YANNICK VANDENDAEL
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Title:
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RIGID AND SEMIRIGID THERMOPLASTIC STRUCTURES WITH MULTIPLE COEXTRUDED POLYMERIC LAYERS INCORPORATING AN INNER VINYLIDENE CHLORIDE COPOLYMER LAYER AND USE OF THESE STRUCTURES FOR THE MANUFACTURE OF PACKAGES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST.
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33, RUE DU PRINCE ALBERT, |
BRUSSELS, BELGIUM B-1050 |
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SPENCER & FRANK |
1111 NINETEENTH ST., N.W. |
WASHINGTON, D.C. 20036 |
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