Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/19/1988
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Application #:
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06878307
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Filing Dt:
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06/25/1986
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Inventor:
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RICHARD C. WOOD
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Title:
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SOLDER FINISHING INTEGRATED CIRCUIT PACKAGE LEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| DANIEL H. KANE, JR. |
| FENTON, CHAPMAN, FENTON, SMITH & |
| KANE |
| 109 MAIN ST. |
| BAR HARBOR, ME 04609 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| M/S D3-579 |
| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| LIMBACH & LIMBACH L.L.P. |
| MICHAEL J. POLLOCK |
| 2001 FERRY BUILDING |
| SAN FRANCISCO, CALIFORNIA 94111 |
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